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封裝結構的熱力可靠性方案 Influence of flip-chip attachment process on IC Moisture Diffusion\Moisture Stress Thermal Cycling\Thermal Stresses Solder

Cohesive Zone Modelling for Fatigue Life Analysis of Adhesive Joints (2022, Springer).pdf

The software's ability to model solder joint fatigue, complicate process warpage of 2.5D wafer, drop and vibration test etc. that align with experimental data well.

上面一排為4個不同模態時的model Stress，第二行從左到右分別為第一個模態的model Stress， Damage ratio，expected fatigue Life(模態應力，損傷，預期疲勞壽命)。IGA和頻域分析求解器可以準確的耦合。

damage in solder joints[C]//Fifth World Congress on Computational Mechanics July 7–12, 2002, Vienna:1 [15] ZAHN B A, Finite Element Based Solder Joint Fatigue Life Predictions for a Same Die Stacked

Worksheet Graph Tabular Data Press new shortcut key: Description: This result contour plot shows the available life for the given fatigue analysis